RFID Automatic Flip Chip System

Model:LDT-HA1024

Our RFID Flip-Chip System is using Visual System to locate the chip and the antenna with the throughput in almost 99.5% yield. All processes are in one system platform which includes antenna web handling, epoxy jetting, flip chip, final curing, and testing. Available for all types of HF / UHF RFID Inlay

•   Loading Module
 
•   Dispensing Module
 
•   Flip Chip Module

•   Visual Module

•   Wafer Module

•   Buffer Module

•   Heating Curing Module

•   HF/UHF Testing Module

•   Slitting Module

•   Unloading Module

•   Chip Backing Paper Module

APPLICATIONS