RFID Automatic Flip Chip System

Model:LDT-BTA2019A

XJL-TTA20000 is the first domestically developed and innovative single-channel RFID production equipment. It has a number of invention patents and utility model patents which uses a high-precision visual motion system to accurately identify RFID chips and flexible antennas, positioning and high-speed precision actuators to achieve precise binding of microchips and antennas.

With the throughput in almost 99.5% yield, all of our processes are in one system platform which includes antenna web handling, epoxy jetting, flip chip, final curing, and testing. Available for all types of HF / UHF RFID Inlay

•   Loading Module
 
•   Dispensing Module
 
•   Flip Chip Module

•   Visual Module

•   Wafer Module

•   Buffer Module

•   Heating Curing Module

•   HF/UHF Testing Module

•   Slitting Module

•   Unloading Module

•   Chip Backing Paper Module

APPLICATIONS