RFID Inlay Sample Bonding Machine

Model:LTD-WD2019A

Due to the booming of RFID technology, to meet the needs of different RFID inlay sample, we launch the new bonding machine which is widely used in lab for RFID inlay sample making

•   Range in testing device: The adaptive experiment of electrician, electric parts and related materials in high/low temperature saving, transportation and using 

•   Testing condition: Environment temperature is +25℃. Relative humidity ≤85%. No exist samples in testing chamber.

•   Testing way: GB/T 5170.2-1996 temperature testing device and GB/T 5170.5-1996 damp and hot testing device (Only damp/hot model)

•   Temperature range: -70℃→+150℃ (Temperature fluctuate in ±0.5℃ and distribution accuracy in ±2.0℃)

•   Humidity range: 20%～98%R.H (Humidity fluctuate in ±3%R.H and distribution accuracy in ±3.0%.) (Only damp/hot model)

•   Heating up time: -70℃→+150℃ and 4.0℃/min in heating up time

•   Heating down time: +150℃→ -70℃ and 1.0℃/min in heating down time

TECHNICAL PARAMETERS