1. Automatic punching and cutting hot melt adhesive tape, dispensing the glue on the different models of the chip.
2. Adopting PLC control and HMI, which makes sure the running is stable and the parameter is adjustable.The machine is easy to operater and convenient to maintenance.
3. Module transfer stepping controlled by servo system, which could keep the pulling distance be adjusted by parameters directly. The exact photoelectric sensor monitoring makes the module in double protection.
4.Incorporating the functions of module stripe and hot melt glue convey, rush glue, hot welding glue laminating and finished module stripe collecting.
5.Professional desig can realize the changing of 6 pin and 8 pin odule glue tape lamination flexibility, and without changing the mold.The selection can be achieved at the operation interface.