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RFID Automatic Flip Chip System

Presentation:High Speed RFID chip bonding for antenna Advantage:Durable, Max. market share in China local brands Application:RFID Inlay, Label Manufacturer
Send Email:info@ldtkj.com

Product details

Model:LDT-HA1024


Our RFID Flip-Chip System is using Visual System to locate the chip and the antenna with the throughput in almost 99.5% yield. All processes are in one system platform which includes antenna web handling, epoxy jetting, flip chip, final curing, and testing. Available for all types of HF / UHF RFID Inlay


•   Loading Module
 
•   Dispensing Module
 
•   Flip Chip Module

•   Visual Module

•   Wafer Module

•   Buffer Module

•   Heating Curing Module

•   HF/UHF Testing Module

•   Slitting Module

•   Unloading Module

•   Chip Backing Paper Module


ITEM

DESCRIPTIONQTY

High Speed Camera

• Basler• 1 set

Servo Motor

• Panasonnic• 33 sets

Speed Motor

• JSCC• 5 sets

Touch Screen

• Weinview• 2 sets

Lead Screw

• KURODA• 1 set



SPECIFICATIONS

MODEL

LDT-TTA10000

Dimensions

• 7300mm*1500mm*1560mm

Power Supply

• 10KW AC 220V/50HZ

Weight

• 4500KG

Bonding Speed

• 8500 UPH (Related to antenna layout)

Bonding Accuracy

• ±30μm

Wafer Dimensions

• 8", 12"

Chip Specification

• 0.4~2.0mm

Compressed Air

• 0.45Mpa~0.6Mpa

Vacuum Pressure

• -80Kpa~-100Kpa

Material Bandwidth

• 100mm—370mm

Bound Point Spacing

• CD>16mm MD>30mm


APPLICATIONS

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